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Reduced etch lag and high aspect ratios by deep reactive ion etching (DRIE). (arXiv:2104.02763v1 [physics.plasm-ph]) http://arxiv.org/abs/2104.02763
Reduced etch lag and high aspect ratios by deep reactive ion etching (DRIE). (arXiv:2104.02763v1 [physics.plasm-ph]) http://arxiv.org/abs/2104.02763