@anika_voin Технологическое отверстие для сборки. Замазывать можно.
The hole is called “vent hole” for heat dissipation and alignment. The IHS is glued to the processor substrate with epoxy at the Intel plant. The hole allows gases and pressure to escape while the epoxy cures. Without the hole the pressure would deform the epoxy bond and make the connection between substrate and IHS uneven.